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Sample polishing machine×北川グレステック - List of Manufacturers, Suppliers, Companies and Products

Sample polishing machine Product List

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Automatic Sample Grinding Machine "MECATECH 250/300"

In overall load grinding, the grinding amount can be programmed, allowing for highly reproducible sample grinding regardless of who is performing the work!

The "MECATECH 250/300" is a sample polishing machine that allows for high reproducibility with simple operations by accurately electronically controlling each parameter. The sweep function of the "MECATECH 300SPS" optimizes the use of consumables and improves the flatness of samples. Additionally, by increasing the number of polishable samples from 6 to 8, productivity can also be enhanced. 【Features】 ■ Allows setting of polishing load and rotation speed for each time series ■ Enables soft start and soft end for polishing ■ Supports both manual and automatic polishing ■ Provides optimal polishing regardless of the size or number of samples ■ Allows programming of grinding amount in overall load polishing ■ Controls a three-phase motor using inverter technology ■ Accurately measures and stabilizes air pressure with an electromagnetic valve *For more details, please refer to the PDF document or feel free to contact us.

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Sample Grinding Machine "MINITECH Series"

A sample polishing machine equipped with a powerful motor controlled by an inverter.

The "MINITECH Series" is a sample polishing machine that can accommodate grinding wheels ranging from 200φ to 300φ mm. Equipped with motor power from 750w to 1500w, it features a sturdy body design that allows for easy maintenance and prevents deterioration. By quantifying parameters and the load on the motor via a touch panel, it specializes in reproducibility. 【Features】 ■ Ultra-precise speed variation ■ Constant torque and speed unaffected by load ■ Gradual acceleration and immediate stop capability ■ Ability to change rotation direction to clockwise and counterclockwise ■ Safety mechanism activation even in cases of heat generated by prolonged overload *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment

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